Assembly Only to Full Turn-Key Assemblies
We can process components supplied by the customer or source components according to your bill of materials. We can also advise alternatives which may be more cost-effective or readily available.
Our investment in state-of-the-art equipment allows us to efficiently assemble your PCBs whether the requirement is for a one-off prototype or a production batch.
All of your boards will be inspected by an IPC-certified inspector. We pride ourselves on quality and are constantly looking at ways to improve. We hold JEDEC 001 accreditation.
HGL have invested in an Ersa HR 550 System with desoldering, placement and soldering capabilities of all types of surface mounted devices up to 70 x 70 mm.
• TWS SR2700 Semi-Auto Screen Printer
• Essemtec Pantera X-plus Pick & Place
• Yamaha M20 Pick & Place
• Essemtec RO400FC Convection Reflow Oven
• Ersa HR 550 BGA Rework Station
Min. Component Size: 0201
Max. PCB Size: 420mm x 335mm
Max. Board Thickness: 4.8mm
Min. Board Thickness: 0.4mm
Placement Accuracy: 40μm
Placements per Hour: ~23,000
Component types: Max 180 types